IEEE Rao R. Tummala Electronics Packaging Award: Difference between revisions

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== About Award ==
==About Award==


[[Image:IEEE Components, Packaging, and Manufacturing Technology Award.jpg|thumb|right]]
[[Image:IEEE Components, Packaging, and Manufacturing Technology Award.jpg|thumb|right]]


The IEEE CPMT Award was established in 2002.
The IEEE Components, Packaging, and Manufacturing Technology Award was established in 2002, and was renamed the IEEE Electronics Packaging Award in 2017, and renamed in 2020 in honor of Professor Tummala.


Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.
Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.


== Recipient List ==
==Recipient List==


*[[John W. Balde]], 2004
*[[John W. Balde]], 2004
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*[[Paul A. Totta]], 2008
*[[Paul A. Totta]], 2008
*[[George G. Harman]], 2009
*[[George G. Harman]], 2009
*Herbert Riechl, 2010
*[[Herbert Reichl]], 2010
*[[Rao R. Tummala]], 2011
*[[Mauro J. Walker]], 2012
*[[John H. Lau]], 2013
*[[Avram Bar-Cohen]], 2014
*[[Nasser Bozorg-Grayeli]], 2015
*[[Michael Pecht]], 2016
*[[Paul S. Ho]], [[King-Ning Tu]], 2017
*[[William T. Chen]], 2018
*[[Ephraim Suhir]], 2019
*[[Mitsumasa Koyanagi]], Peter Ramm, 2020
*[[Chin C. Lee]], 2021
*[[Douglas C.H. Yu]], 2022
*[[Guoqi (Kouchi) Zhang]], 2023
*Madhavan Swaminathan, 2024


[[Category:IEEE|Components]] [[Category:Awards & fellow activities|Components]]
[[Category:IEEE|Electronics]]  
[[Category:Awards & fellow activities|Electronics]]

Latest revision as of 15:50, 18 January 2024

About Award

IEEE Components, Packaging, and Manufacturing Technology Award.jpg

The IEEE Components, Packaging, and Manufacturing Technology Award was established in 2002, and was renamed the IEEE Electronics Packaging Award in 2017, and renamed in 2020 in honor of Professor Tummala.

Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.

Recipient List