Herbert Reichl: Difference between revisions

Latest revision as of 16:36, 28 January 2016

Biography

Herbert Reichl was one of the first researchers to foresee the importance of microelectronics packaging in bridging the gap between research and applications. His pioneering work on heterogeneous integration, three-dimensional packaging, and embedded passive and active components set the path for future microelectronics, enabling applications ranging from mobile phones to wearable sensors. As founding director of Germany’s Fraunhofer Institute for Reliability and Microintegration (IZM), Dr. Reichl has led many integration strategies and shepherded their transfer to commercialization. The exciting concept of electronic grains (or eGrains) is just one example. Functioning as tiny electronic sensors that can receive, process and store information, eGrains are very small, autonomous modules that can communicate with each other wirelessly, enabling “smart” devices. An IEEE Fellow, Dr. Reichl is currently a professor at the Technical University of Berlin, Germany, and continues to mentor generations of students and research staff in the area of R&D.

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-== Biography  ==
+{{Biography
+|Image=Reichl H.jpg
+|Associated organizations=Fraunhofer Institute for Reliability
+|Fields of study=Microelectronics
+}}
+Herbert Reichl was one of the first researchers to foresee the importance of microelectronics packaging in bridging the gap between research and applications. His pioneering work on heterogeneous integration, three-dimensional packaging, and embedded passive and active components set the path for future microelectronics, enabling applications ranging from mobile phones to wearable sensors. As founding director of Germany’s Fraunhofer Institute for Reliability and Microintegration (IZM), Dr. Reichl has led many integration strategies and shepherded their transfer to commercialization. The exciting concept of electronic grains (or eGrains) is just one example. Functioning as tiny electronic sensors that can receive, process and store information, eGrains are very small, autonomous modules that can communicate with each other wirelessly, enabling “smart” devices. An [[IEEE Fellow Grade History|IEEE Fellow]], Dr. Reichl is currently a professor at the Technical University of Berlin, Germany, and continues to mentor generations of students and research staff in the area of R&D.
-[[Image:Reichl H.jpg|thumb|right]]
+[[Category:Electronic equipment manufacture]]
+[[Category:Electronics packaging]]
-Herbert Reichl was one of the first researchers to foresee the importance of microelectronics packaging in bridging the gap between research and applications. His pioneering work on heterogeneous integration, three-dimensional packaging, and embedded passive and active components set the path for future microelectronics, enabling applications ranging from mobile phones to wearable sensors. As founding director of Germany’s Fraunhofer Institute for Reliability and Microintegration (IZM), Dr. Reichl has led many integration strategies and shepherded their transfer to commercialization. The exciting concept of electronic grains (or eGrains) is just one example. Functioning as tiny electronic sensors that can receive, process and store information, eGrains are very small, autonomous modules that can communicate with each other wirelessly, enabling “smart” devices. An [[IEEE Fellow Grade History|IEEE Fellow]], Dr. Reichl is currently a professor at the Technical University of Berlin, Germany, and continues to mentor generations of students and research staff in the area of R&D.
-[[Category:Electronic_equipment_manufacture]]
+{{DEFAULTSORT:Reichl}}
-[[Category:Electronics_packaging]]