Category:Thermal management of electronics: Difference between revisions
From ETHW
No edit summary |
No edit summary |
||
| Line 3: | Line 3: | ||
== Subcategories == | == Subcategories == | ||
*'''[[:Category:Electronic cooling|Electronic cooling]]''' | *'''[[:Category:Electronic cooling|Electronic cooling]]''' - techniques used to keep electronic devices functional by dissipating generated heat | ||
*'''[[:Category:Electronic packaging thermal management|Electronic packaging thermal management]]''' | *'''[[:Category:Electronic packaging thermal management|Electronic packaging thermal management]]''' - the use of the packaging in electronic circuits to limit and control heat | ||
[[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]] | [[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]] | ||
Revision as of 20:32, 10 October 2011
Topics dealing with heat in electronics
Subcategories
- Electronic cooling - techniques used to keep electronic devices functional by dissipating generated heat
- Electronic packaging thermal management - the use of the packaging in electronic circuits to limit and control heat
Subcategories
This category has the following 2 subcategories, out of 2 total.
Pages in category "Thermal management of electronics"
The following 6 pages are in this category, out of 6 total.
Media in category "Thermal management of electronics"
This category contains only the following file.
Thermal Management for Electronics Heat Flux Centers.jpg 340 × 255; 10 KB
