Category:Electronic equipment manufacture: Difference between revisions

From ETHW
No edit summary
m (Text replace - "[[Category:Computers_and_information_processing" to "[[Category:Computing and electronics")
 
(2 intermediate revisions by the same user not shown)
Line 3: Line 3:
== Subcategories ==
== Subcategories ==


*'''[[:Category:Damascene integration|Damascene integration]]''' - the use of additive patterning of metal to create copper interconnections on a silicon oxide layer in integrated circuits
*'''[[:Category:Electronics packaging|Electronics packaging]]''' - the enclosures and protective layers built into an electronic device
*'''[[:Category:Electronics packaging|Electronics packaging]]''' - the enclosures and protective layers built into an electronic device
*'''[[:Category:Environmentally friendly manufacturing techniques|Environmentally friendly manufacturing techniques]]''' - electronic manufacturing techniques that aim to minimize damage to the natural environment
*'''[[:Category:Environmentally friendly manufacturing techniques|Environmentally friendly manufacturing techniques]]''' - electronic manufacturing techniques that aim to minimize damage to the natural environment
Line 10: Line 9:
*'''[[:Category:Semiconductor device packaging|Semiconductor device packaging]]''' - the packaging of a semiconductor device or integrated circuit to enclose and protect it
*'''[[:Category:Semiconductor device packaging|Semiconductor device packaging]]''' - the packaging of a semiconductor device or integrated circuit to enclose and protect it


[[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]]
[[Category:Computing and electronics|{{PAGENAME}}]]

Latest revision as of 16:16, 22 July 2014

Various elements related to the manufacturing element of components, circuitry and devices are included in this category

Subcategories