Category:Electronic equipment manufacture
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== Subcategories == | == Subcategories == | ||
| − | *'''[[:Category:Damascene integration|Damascene integration]]''' | + | *'''[[:Category:Damascene integration|Damascene integration]]''' - the use of additive patterning of metal to create copper interconnections on a silicon oxide layer in integrated circuits |
| − | *'''[[:Category:Electronics packaging|Electronics packaging]]''' | + | *'''[[:Category:Electronics packaging|Electronics packaging]]''' - the enclosures and protective layers built into an electronic device |
| − | *'''[[:Category:Environmentally friendly manufacturing techniques|Environmentally friendly manufacturing techniques]]''' | + | *'''[[:Category:Environmentally friendly manufacturing techniques|Environmentally friendly manufacturing techniques]]''' - electronic manufacturing techniques that aim to minimize damage to the natural environment |
| − | *'''[[:Category:Micromachining|Micromachining]]''' | + | *'''[[:Category:Micromachining|Micromachining]]''' - mechanical objects that are fabricated in the same manner as integrated circuits |
| − | *'''[[:Category:Semiconductor device manufacture|Semiconductor device manufacture]]''' | + | *'''[[:Category:Semiconductor device manufacture|Semiconductor device manufacture]]''' - the manufacture of devices using semiconductors |
| − | *'''[[:Category:Semiconductor device packaging|Semiconductor device packaging]]''' | + | *'''[[:Category:Semiconductor device packaging|Semiconductor device packaging]]''' - the packaging of a semiconductor device or integrated circuit to enclose and protect it |
[[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]] | [[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]] | ||
Latest revision as of 16:16, 28 September 2011
Various elements related to the manufacturing element of components, circuitry and devices are included in this category
Subcategories
- Damascene integration - the use of additive patterning of metal to create copper interconnections on a silicon oxide layer in integrated circuits
- Electronics packaging - the enclosures and protective layers built into an electronic device
- Environmentally friendly manufacturing techniques - electronic manufacturing techniques that aim to minimize damage to the natural environment
- Micromachining - mechanical objects that are fabricated in the same manner as integrated circuits
- Semiconductor device manufacture - the manufacture of devices using semiconductors
- Semiconductor device packaging - the packaging of a semiconductor device or integrated circuit to enclose and protect it
Subcategories
This category has the following 6 subcategories, out of 6 total.
D
E
M
S
Pages in category "Electronic equipment manufacture"
The following 25 pages are in this category, out of 25 total.
