Category:Electronic equipment manufacture: Difference between revisions

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Various elements related to the manufacturing element of components, circuitry and devices are included in this category


IEEE GHN Category [[Category:Components, circuits, devices & systems]]
== Subcategories ==
 
*'''[[:Category:Damascene integration|Damascene integration]]''' - the use of additive patterning of metal to create copper interconnections on a silicon oxide layer in integrated circuits
*'''[[:Category:Electronics packaging|Electronics packaging]]''' - the enclosures and protective layers built into an electronic device
*'''[[:Category:Environmentally friendly manufacturing techniques|Environmentally friendly manufacturing techniques]]''' - electronic manufacturing techniques that aim to minimize damage to the natural environment
*'''[[:Category:Micromachining|Micromachining]]''' - mechanical objects that are fabricated in the same manner as integrated circuits
*'''[[:Category:Semiconductor device manufacture|Semiconductor device manufacture]]''' - the manufacture of devices using semiconductors
*'''[[:Category:Semiconductor device packaging|Semiconductor device packaging]]''' - the packaging of a semiconductor device or integrated circuit to enclose and protect it
 
[[Category:Components,_circuits,_devices_&_systems|{{PAGENAME}}]]

Revision as of 16:16, 28 September 2011

Various elements related to the manufacturing element of components, circuitry and devices are included in this category

Subcategories